A thyristor will stay conducting until the current through the device is zero (“current zero”) or perhaps slightly negative. LLNL’s approach is to use the opticondistor (“OTV”) to force this current zero in order to force the device into an “off” state. By combining a light-activated thyristor with an OTV, a noise-immune, high efficiency, high-power switching device can be constructed. The…
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![Potential reactor configurations with printed TPMS scaffolds](/sites/default/files/styles/scale_exact_400x400_/public/2023-12/Reactor_Config_with_TPMS_scaffolds.png?itok=stDW7Z7n)
LLNL researchers have devised a set of design principles that facilitates the development of practical TPMS-based two fluid flow reactors.; included in the design are these new concepts:
![LLNL energy grid protection device](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/LLNL%20energy%20grid%20protection%20device_0.png?itok=vpqzRY_R)
The approach is to leverage the fact that a momentary “load” equal to the power transmission line impedance, (Z0), during the transient can suppress its propagation. Z(0) is typically a fixed impedance of several hundred ohms based on the geometry of most single wire transmission lines.
So, an isolated self-powered opticondistor (OTV) system may provide an ultrafast method of…
![Filled (8,8) (left) and (15,15) (right) CNTs with [EMIM+][BF4- ] using SGTI with the proposed spliced soft-core potential (SSCP) approach](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/Filled%20CNTs%20using%20SGTI.png?itok=Dy0ObN7i)
LLNL researchers have developed a novel simulation methodology using slow growth thermodynamic integration (SGTI) utilizing spliced soft-core interaction potential (SSCP). The approach to filling the molecular enclosures is a nonphysical one. Rather than filling the pores from the open ends this method creates steps in the algorithm that allow molecules to pass through the pore wall and…
![Cross Section of the High-Voltage Insulator Joint](/sites/default/files/styles/scale_exact_400x400_/public/2023-05/HighVoltageInsulatorJoint.png?itok=afTeKYkH)
The approach is to build a high voltage insulator consisting of two materials: Poly-Ether-Ether-Ketone (“PEEK”) and Machinable Ceramic (“MACOR”). PEEK has a high stress tolerance but cannot withstand high temperatures, while MACOR has high heat tolerance but is difficult to machine and can be brittle. MACOR is used for the plasma-facing surface, while PEEK will handle the stresses and high…
![An artist’s concept rendering of a 3.5-meter linear induction accelerator (LIA) with four lines-of-sight toward a patient. The blue elements magnetically focus and direct the LIA’s electron beams.](/sites/default/files/styles/scale_exact_400x400_/public/2023-04/ArtistConceptofLIA.png?itok=Q2EzmJb1)
LLNL’s approach is to use their patented Photoconductive Charge Trapping Apparatus (U.S. Patent No. 11,366,401) as the active switch needed to discharge voltage across a vacuum gap in a particle accelerator, like the one described in their other patent (U.S. Patent No.
![Nanoporus gold](/sites/default/files/styles/scale_exact_400x400_/public/2022-06/nanoporus%20gold%20875x500.jpg?itok=A0gFmVPT)
By combining 3D printing and dealloying., researchers at LLNL have developed a method for fabricating metal foams with engineered hierarchical architectures consisting of pores at least 3 distinct length scales. LLNL’s method uses direct ink writing (DIW), a 3D printing technique for additive manufacturing to fabricate hierarchical nanoporous metal foams with deterministically controlled 3D…
![energy_absorbing_material.jpg energy_absorbing_material](/sites/default/files/styles/scale_exact_400x400_/public/2019-08/energy_absorbing_material.jpg?itok=UxNZ6nWH)
To overcome limitations with cellular silicone foams, LLNL innovators have developed a new 3D energy absorbing material with tailored/engineered bulk-scale properties. The energy absorbing material has 3D patterned architectures specially designed for specific energy absorbing properties. The combination of LLNL's capabilities in advanced modeling and simulation and the additive…