As bioelectronic interfaces trend toward smaller features and channel counts into the thousands, there is a need for a high-density connector to accommodate these signals and interface the passive bioelectronic interface to active electronics. Given that nearly the entire market for high-channel-count bioelectronic interfaces – and neural interfaces in particular – are in research and short-term clinical trials, this represents a major unmet need and untapped market segment.
Current approaches depend on commercial connectors that have tens of contacts or permanent flip-chip or wire bonding techniques. These approaches, however,
(a) dramatically increase the overall size of the device and are impractical to scale,
(b) are time consuming to implement, and/or
(c) are irreversible.
Implantable bioelectronic interfaces are inherently single-use, and the custom active electronics are limited, so a nonpermanent connection strategy capable of handling high channel counts within a small volume is required.
LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more than 1000 channels. A small compression force is applied during the assembly of the high-density connector that allows for electrical connections to be made between two contact arrays. The novel design can include a compressible elastomeric layer and/or well-positioned bumps or ridges on backing plate that allow for even force distribution and improved electrical contact.
- Minimize total connector area and volume with fine pitch in two dimensions and the option to utilize the third dimension
- Reversible zero insertion force connection- it takes no (or negligible) force to mate two halves of a connector.
- A user simply brings the two halves of the connector together and it effortlessly snaps into functionally perfect alignment.
- Allow connection when one or both substrates are extremely flexible.
Currently available neural probes have integrated or permanently bonded custom electronics. The shortcoming of these probes is high device costs as the electronics are inherently single-use. While these probes are suitable for long-term clinical implantation in humans, they present a significant barrier to acute or sub-chronic clinical trials, fundamental research, early-stage commercial development, and cost-sensitive markets. LLNL’s high-density, high channel connector could potentially fill this untapped market segment.
Current stage of technology development: TRL-2
LLNL has filed for patent protection on this invention.