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Picture of SLA printed structures using 3D printable nitrile-containing photopolymer resins

LLNL’s invention is a photopolymerizable polymer resin that consists of one or more nitrile-functional based polymers. The resin is formulated for SLA based 3D printing allowing for the production of nitrile-containing polymer components that can then be thermally processed into a conductive, highly graphitic materials. The novelty of the invention lies in (1) the photo-curable nitrile-…

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Picture of interlocked electrode structure with metal plated surfaces

LLNL researchers have developed a fabrication process for creating 3D random interdigitated architectures of anodes and cathodes, eliminating the need for a membrane to separate them.  This approach is similar to the repeating interdigitated multi-electrode architectures that also were developed at LLNL. 

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Printed TPMS membrane structures using nanoporous photoresist

LLNL researchers have developed novel advanced manufactured biomimetic 3D-TPMS (triply periodic minimal surface) membrane architectures such as a 3D gyroid membrane. The membrane is printed using LLNL's nano-porous photoresist technology.  LLNL’s 3D-TPMS membranes consist of two independent but interpenetrating macropore flow channel systems that are separated by a thin nano-porous wall.  3D-…

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Electrodeposition of Zn onto 3D printed copper nanowire (CuNW)

Improving the active material of the Zn anode is critical to improving the practicality of Zn-MnO2 battery technology. LLNL researchers have developed a new category of 3D structured Zn anode using a direct-ink writing (DIW) printing process to create innovative hierarchical architectures.  The DIW ink, which is a gel-based mixture composed of zinc metal powder and organic binders, is extruded…

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New class of lattice-based substrates

To get the best of both worlds – the sensitivity of LC-MS with the speed of PS-MS – and a functional substrate that can maintain sample integrity, LLNL researchers looked to 3D printing.  They have patented a novel approach to create lattice spray substrates for direct ionization mass spectroscopy using 3D-printing processes.

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SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…

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3D Printing of High Viscosity Reinforced Silicone Elastomers

LLNL researchers, through careful control over the chemistry, network formation, and crosslink density of the ink formulations as well as introduction of selected additives, have been successful in preparing 3D printable silicone inks with tunable material properties.  For DIW (direct in writing) applications, LLNL has a growing IP portfolio around 3D printable silicone feedstocks for diverse…

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3D Printing of Fiber Reinforced Composite Thermoset Structures

LLNL’s method of 3D printing fiber-reinforced composites has two enabling features:

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drift_meter_thumb

LLNL’s Optically-based Interstory Drift Meter System provides a means to accurately measure the dynamic interstory drift of a vibrating building (or other structure) during earthquake shaking. This technology addresses many of the shortcomings associated with traditional strong motion accelerometer based building monitoring.

LLNL’s discrete diode position sensitive device is a newly…

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microcantilever3

LLNL has developed a compact and low-power cantilever-based sensor array, which has been used to detect various vapor-phase analytes. For further information on the latest developments, see the article "Sniffing the Air with an Electronic Nose."

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Electronic Wave

The invention relates to a measurement method and system for capturing both the amplitude and phase temporal profile of a transient waveform or a selected number of consecutive waveforms having bandwidths of up to about 10 THz in a single shot or in a high repetition rate mode. The invention consists of an optical preprocessor which can then output a time-scaled replica of the input signal to…