This LLNL invention is comprised of (1) a volumetric subtractive manufacturing system which can tomographically manufacture 3D structures with negative features (materials in negative space is degraded with light exposure), and (2) a hybrid volumetric additive/subtractive manufacturing system in which a gelled/solid structure is printed by resin material polymerization using one light, and…

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual…

LLNL has developed a system and method that accomplishes volumetric fabrication by applying computed tomography (CT) techniques in reverse, fabricating structures by exposing a photopolymer resin volume from multiple angles, updating the light field at each angle. The necessary light fields are spatially and/or temporally multiplexed, such that their summed energy dose in a target resin volume…