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Cross-section of the target chamber in an artist’s concept of an inertial fusion energy power plant

LLNL researchers have developed additive manufactured fuel targets for IFE.  They have been successful in using TPL to fabricate low density (down to 60 mg/cm3) and low atomic number (CHO) polymeric foams for potential targets, and some have been tested at the OMEGA Laser Facility. With TPL, LLNL researchers have also been able to fabricate a full fuel capsule with diameter of ~ 5mm or…

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SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual…