LLNL researchers have developed additive manufactured fuel targets for IFE. They have been successful in using TPL to fabricate low density (down to 60 mg/cm3) and low atomic number (CHO) polymeric foams for potential targets, and some have been tested at the OMEGA Laser Facility. With TPL, LLNL researchers have also been able to fabricate a full fuel capsule with diameter of ~ 5mm or…
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LLNL’s Distributed Implicit Neural Representation (DINR) is a novel approach to 4D time-space reconstruction of dynamic objects. DINR is the first technology to enable 4D imaging of dynamic objects at sufficiently high spatial and temporal resolutions that are necessary for real world medical and industrial applications.

LLNL researchers have developed a method to enhance the performance of polyelectrolyte membranes by using a humidity-controlled crosslinking process which can be applied to precisely adjust the water channels of the membrane.

This invention configures multiple spherical substrate targets to roll independently of one another. The spheres’ rolling motion is deliberately randomized to promote uniform coating while eliminating the interaction (rubbing, sliding) of adjacent spheres that is present in conventional sphere coating designs. The devices’ novel structure features enable the collimation of depositing…


The LiDO code combines finite element analysis, design sensitivity analysis and nonlinear programming in a High-Performance Computing (HPC) environment that enables the solution of large-scale structural optimization problems in a computationally efficient manner. Currently, the code uses topology optimization strategies in which a given material is optimally distributed throughout the domain…

Simrev is a python library imported into a user-generated program. As the program grows in capability and complexity, the engineered product matures. The "software twin" handles all changes to product configuration and is the portal to running supercomputing analysis and managing workflow for engineering simulation codes. Assemblies become program modules; parts, materials, boundary conditions…