LLNL’s Distributed Implicit Neural Representation (DINR) is a novel approach to 4D time-space reconstruction of dynamic objects. DINR is the first technology to enable 4D imaging of dynamic objects at sufficiently high spatial and temporal resolutions that are necessary for real world medical and industrial applications.
Image
For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process. The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer. The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual…