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SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…

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drift_meter_thumb

LLNL’s Optically-based Interstory Drift Meter System provides a means to accurately measure the dynamic interstory drift of a vibrating building (or other structure) during earthquake shaking. This technology addresses many of the shortcomings associated with traditional strong motion accelerometer based building monitoring.

LLNL’s discrete diode position sensitive device is a newly…

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Electronic Wave

The invention relates to a measurement method and system for capturing both the amplitude and phase temporal profile of a transient waveform or a selected number of consecutive waveforms having bandwidths of up to about 10 THz in a single shot or in a high repetition rate mode. The invention consists of an optical preprocessor which can then output a time-scaled replica of the input signal to…