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LLNL researchers prepare an experiment in a spherical chamber at the High Explosives Applications Facility (HEAF)

LLNL has developed a method that adds a polyamine based crosslinker and an acid receptor, based on MgO nanoparticles into a polymer bonded PBX, where the polymer binder is a fluoropolymer containing vinylidene difluoride functionality.  Crosslinking kinetics can then be controlled by selecting an appropriate amine structure, pressing temperature and optionally the addition of a chemical…

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High Explosives Science, abstract smoke stock photo

LLNL researchers uses Additive Manufacturing (AM) to create reinforcing scaffolds that can be integrated with High Explosives (HE) or solid rocket fuel with minimal volume fraction. Its main benefit is to create stability in harsh field conditions.  Its secondary benefit is providing another method to finely tune blast performance or fuel burn. Creating complex shapes with structural…

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SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual…