Skip to main content
Image
Stock image of brain and electronic interface

LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more…

Image
Schematic of high density detachable electrical interfaces with a single layer

Many of the disadvantages of current interface devices can be overcome with LLNL’s novel interface design, which relies on area array distribution where independent interface connector subassemblies are positioned in a planar grid.  Not only is the interface device expandable area-wise (without increasing contact force), but it could also be expanded height-wise, with multiple layers of…

Image
Flexible optoelectronic chip with integrated transmitter and receiver subassemblies

Commercial fiber optic cables are the current standard for carrying optical signals in industries like communications or medical devices. However, the fibers are made of glass, which do not have favorable characteristics for applications that require flexibility and re-routing, e.g. typically brittle, limited selection of materials, dimension constraints.

Image
iChip, brain on a chip

LLNL has developed a brain-on-a-chip system with a removable cell-seeding funnel to simultaneously localize neurons from various brain regions in an anatomically relevant manner and over specific electrode regions of a MEA. LLNL’s novel, removable cell seeding funnel uses a combination of 3D printing and microfabrication that allows neurons from select brain regions to easily be seeded into…