LLNL’s novel approach utilizes a number of techniques to improve reconstruction accuracy:
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For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process. The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer. The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…
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Versatile Cold Spray (VCS) enables deposition of brittle materials, such as thermoelectrics, magnets, and insulators, while retaining their functional properties. Materials can be deposited on substrates or arbitrary shapes with no requirement to match compositions. The VCS system is low cost, easily portable, and easy to use.
VCS has been developed in a collaboration between Lawrence Livermore…
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LLNL pioneered the use of tomographic reconstruction to determine the power density of electron beams using profiles of the beam taken at a number of angles. LLNL’s earlier diagnostic consisted of a fixed number of radially oriented sensor slits and required the beam to be circled over them at a fixed known diameter to collect data. The new sensor design incorporates annular slits instead,…
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LLNL has developed a compact and low-power cantilever-based sensor array, which has been used to detect various vapor-phase analytes. For further information on the latest developments, see the article "Sniffing the Air with an Electronic Nose."