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Stock image of brain and electronic interface

LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more…

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Adobe Stock image laser beam

This invention proposes to engineer the current density along the length of a laser diode to overcome the penalty associated with non-uniformity resulting from asymmetry in the gain, photon or carrier density despite having uniform contact. Optimizing the current density profile enables diode lasers to operate with greater power conversion efficiency or operate with equivalent power conversion…

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Schematic showing mismatched coefficient of thermal expansion (CTE) coating

This invention proposes to engineer the temperature dependence of the emission wavelength of LEDs and laser diodes. The approach is to use a strain-inducing coating to counteract the intrinsic temperature coefficient of the emission wavelength of the LED or laser diode device thereby rendering it athermal. This invention avoids additional complexity, size, weight and power dissipation of…

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Photoconductive Semiconductor Laser Diodes and LEDs

This invention proposes a method to overcome the key limitation of electrically pumped lasers based on AlN, AlGaN, or AlInGaN, namely the lack of suitable shallow donor and acceptor dopants. As the band gap of these materials increases (and the emission wavelength decreases), both electrons and holes require greater thermal energies in order to ionize.

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Adobe Stock image laser beam

Laser diode lensing effect can be substantially reduced by creating a pattern interface such that the substrate is only attached at the diode mesa. This is achieved by either creating a pattern solder joint and/or pattern substrate.

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Schematic of high density detachable electrical interfaces with a single layer

Many of the disadvantages of current interface devices can be overcome with LLNL’s novel interface design, which relies on area array distribution where independent interface connector subassemblies are positioned in a planar grid.  Not only is the interface device expandable area-wise (without increasing contact force), but it could also be expanded height-wise, with multiple layers of these…

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Flexible optoelectronic chip with integrated transmitter and receiver subassemblies

Commercial fiber optic cables are the current standard for carrying optical signals in industries like communications or medical devices. However, the fibers are made of glass, which do not have favorable characteristics for applications that require flexibility and re-routing, e.g. typically brittle, limited selection of materials, dimension constraints.

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Plasma wind
CRETIN is a 1D, 2D, and 3D non-local thermodynamic equilibrium (NLTE) atomic kinetics/radiation transport code which follows the time evolution of atomic populations and photon distributions as radiation interacts with a plasma consisting of an arbitrary mix of elements. It can provide detailed spectra for comparing with experimental diagnostics.
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Intrinsic Use Control

LLNL's method of equivalent time sampling incorporates an embedded system that generates the pulses used to trigger the external circuit and the data acquisition (DAQ). This removes the external reference clock, allowing the overall system clock rate to change based on the ability of the embedded system. The time delays needed to create the time stepping for equivalent time sampling is done by…

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Toy model demonstration of a Napier Deltic Engine. Thermo-structural analysis in Diablo with piston pressure. Simrev software-twin is seven python modules; pistons, crank-arms, gears, etc.; and a main program. Total 600 lines of code.

Simrev is a python library imported into a user-generated program. As the program grows in capability and complexity, the engineered product matures. The "software twin" handles all changes to product configuration and is the portal to running supercomputing analysis and managing workflow for engineering simulation codes. Assemblies become program modules; parts, materials, boundary conditions…

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iChip, brain on a chip

LLNL has developed a brain-on-a-chip system with a removable cell-seeding funnel to simultaneously localize neurons from various brain regions in an anatomically relevant manner and over specific electrode regions of a MEA. LLNL’s novel, removable cell seeding funnel uses a combination of 3D printing and microfabrication that allows neurons from select brain regions to easily be seeded into…