LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more…
Keywords
- Show all (112)
- Instrumentation (38)
- Diagnostics (13)
- Imaging Systems (9)
- Photoconductive Semiconductor Switches (PCSS) (9)
- Semiconductors (6)
- Therapeutics (5)
- Optical Switches (4)
- Sensors (3)
- Computing (2)
- Electric Grid (2)
- MEMS Sensors (2)
- Optical Sensors (2)
- Particle Accelerators (2)
- Rare Earth Elements (REEs) (2)
- Spectrometers (2)
- Vaccines (2)
- Additive Manufacturing (1)
- (-) Brain Computer Interface (BCI) (4)
- (-) Power Electronics (3)
- (-) Precision Engineering (1)
![LLNL energy grid protection device](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/LLNL%20energy%20grid%20protection%20device_0.png?itok=vpqzRY_R)
The approach is to leverage the fact that a momentary “load” equal to the power transmission line impedance, (Z0), during the transient can suppress its propagation. Z(0) is typically a fixed impedance of several hundred ohms based on the geometry of most single wire transmission lines.
So, an isolated self-powered opticondistor (OTV) system may provide an ultrafast method of…
![JFET Device Structure](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/JFET%20device%20structure.png?itok=NRzXbnhk)
LLNL’s novel approach is to use diamond substrates with the desired donor (nitrogen) and acceptor (boron) impurities. In order to optically activate these deep impurities, the invention requires at least one externally or internally integrated light source. The initial exposure to light can set up the desired conduction current, after which the light source could be turned off. Even with…
![Tunneling Diode between two DSRDs](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/TunnelingDiode.png?itok=DfeB26vp)
Instead of producing individual DSRDs and bonding them, Tunnel DSRD's entire stack structure is grown epitaxially on a n- or p-type silicon wafer, resulting in a novel, “monolithic” stacked DSRD. A tunnel diode is essentially a diode with very highly doped p and n regions such that the reverse breakdown voltage is 200 meV or lower.
![Schematic of high density detachable electrical interfaces with a single layer](/sites/default/files/styles/scale_exact_400x400_/public/2023-04/High%20density%20detachable%20interface_single.png?itok=HqwlqXwl)
Many of the disadvantages of current interface devices can be overcome with LLNL’s novel interface design, which relies on area array distribution where independent interface connector subassemblies are positioned in a planar grid. Not only is the interface device expandable area-wise (without increasing contact force), but it could also be expanded height-wise, with multiple layers of these…
![Flexible optoelectronic chip with integrated transmitter and receiver subassemblies](/sites/default/files/styles/scale_exact_400x400_/public/2023-04/Flexible_optoelectronic_chip.png?itok=EVf8ujMo)
Commercial fiber optic cables are the current standard for carrying optical signals in industries like communications or medical devices. However, the fibers are made of glass, which do not have favorable characteristics for applications that require flexibility and re-routing, e.g. typically brittle, limited selection of materials, dimension constraints.
![mesoscale_nand_gate.jpg mesoscale_nand_gate](/sites/default/files/styles/scale_exact_400x400_/public/2019-08/mesoscale_nand_gate.jpg?itok=0APzWSXN)
Recent advancements in additive manufacturing, also called 3D printing, allow precise placement of materials in three dimensions. LLNL researchers have invented mechanical logic gates based on flexures that can be integrated into the microstructure of a micro-architected material through 3D printing. The logic gates can be combined into circuits allowing complex logic operations to be…
![iChip, brain on a chip](/sites/default/files/styles/scale_exact_400x400_/public/2022-07/iChip.jpg?itok=B-rQJQjn)
LLNL has developed a brain-on-a-chip system with a removable cell-seeding funnel to simultaneously localize neurons from various brain regions in an anatomically relevant manner and over specific electrode regions of a MEA. LLNL’s novel, removable cell seeding funnel uses a combination of 3D printing and microfabrication that allows neurons from select brain regions to easily be seeded into…