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4H-SiC tips fabricated by etching 2 μm wide pillars at 1550 °C for 1 h. The inset shows that the tips are as narrow as 15 nm in diameter

LLNL researchers have developed an approach to form silicon carbide (and diamond) nanoneedles using plasma etching that create micro pillars followed by chemical etching of the pillars in forming gas containing hydrogen and nitrogen. Combining these two etching processes allow for fabrication of micro- and nanoneedles that are thinner and sharper than conventionally fabricated needles.

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Stock image of brain and electronic interface

LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more…

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Colored Pills Stock Image

LLNL researchers have developed a technology suite that includes several methods for detecting trace levels of illicit drugs even in mixtures. These methods can be used as a rapid screening test for incoming samples; for the samples that were determined to contain detectable amounts, they would undergo final verification using conventional laboratory analytical techniques.

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SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual…

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Schematic of high density detachable electrical interfaces with a single layer

Many of the disadvantages of current interface devices can be overcome with LLNL’s novel interface design, which relies on area array distribution where independent interface connector subassemblies are positioned in a planar grid.  Not only is the interface device expandable area-wise (without increasing contact force), but it could also be expanded height-wise, with multiple layers of…

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Flexible optoelectronic chip with integrated transmitter and receiver subassemblies

Commercial fiber optic cables are the current standard for carrying optical signals in industries like communications or medical devices. However, the fibers are made of glass, which do not have favorable characteristics for applications that require flexibility and re-routing, e.g. typically brittle, limited selection of materials, dimension constraints.

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iChip, brain on a chip

LLNL has developed a brain-on-a-chip system with a removable cell-seeding funnel to simultaneously localize neurons from various brain regions in an anatomically relevant manner and over specific electrode regions of a MEA. LLNL’s novel, removable cell seeding funnel uses a combination of 3D printing and microfabrication that allows neurons from select brain regions to easily be seeded into…