LLNL researchers have designed and produced, both conductive and non-conductive porous electrode components manufactured for improved metal deposition, discharging, and fluid dynamics in hybrid flow batteries. This is achieved through Direct Ink Writing (DIW) additive manufacturing. The engineered 3D electrodes enable uniform current distribution and even metal deposition during charging…
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- Imaging Systems (9)
- Photoconductive Semiconductor Switches (PCSS) (9)
- Electric Grid (8)
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- (-) Additive Manufacturing (3)
LLNL researchers have invented an ultrafast PCSS to drive a high-power laser diode with arbitrary pulse widths. These devices operate by supplying a high voltage (>10 kV) to one side of the switch. A short pulse of light illuminates the semiconductor, instantly turning it from highly resistive to highly conductive.
LLNL’s novel approach is to use diamond substrates with the desired donor (nitrogen) and acceptor (boron) impurities. In order to optically activate these deep impurities, the invention requires at least one externally or internally integrated light source. The initial exposure to light can set up the desired conduction current, after which the light source could be turned off. Even with…
Instead of producing individual DSRDs and bonding them, Tunnel DSRD's entire stack structure is grown epitaxially on a n- or p-type silicon wafer, resulting in a novel, “monolithic” stacked DSRD. A tunnel diode is essentially a diode with very highly doped p and n regions such that the reverse breakdown voltage is 200 meV or lower.
Improving the active material of the Zn anode is critical to improving the practicality of Zn-MnO2 battery technology. LLNL researchers have developed a new category of 3D structured Zn anode using a direct-ink writing (DIW) printing process to create innovative hierarchical architectures. The DIW ink, which is a gel-based mixture composed of zinc metal powder and organic binders, is extruded…
For cooling a high power device, the novel approach is to use a thermoelectric cooler (TEC)-based embedded substrate with proper selection of the TEC material as an active cooler. The packaging configuration of TEC allows cooling the entire die without the use of a fluid. The process is compatible with the thin film TEC material. Standard semiconductor processes can be used to manufacture…
For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process. The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer. The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…
The approach is to use Charge Balance Layers (CBLs) to create a superjunction device in wide bandgap materials. These CBLs enable the device to effectively spread the electric field over 2- or 3-dimensions within a semiconductor voltage sustaining layer instead of 1-dimension, thereby increasing the maximum voltage a device is capable of withstanding. The challenge of using CBLs is the…
LLNL researchers have designed and tested performance characteristics for a multichannel pyrometer that works in the NIR from 1200 to 2000 nm. A single datapoint without averaging can be acquired in 14 microseconds (sampling rate of 70,000/s). In conjunction with a diamond anvil cell, the system still works down to about 830K.
LLNL has developed a reference electrode that is a great improvement on the widely used silver or platinum wire QRE commonly used in electrochemistry in ionic liquids. This new reference electrode, based on a silver-sulfide coated silver wire, exhibits greatly improved stability over a QRE. The stability of our RE approaches that of the Ag/Ag+ RE, but unlike the Ag/Ag+ RE, the RE reported here…