LLNL’s invention is a photopolymerizable polymer resin that consists of one or more nitrile-functional based polymers. The resin is formulated for SLA based 3D printing allowing for the production of nitrile-containing polymer components that can then be thermally processed into a conductive, highly graphitic materials. The novelty of the invention lies in (1) the photo-curable nitrile-…
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![Picture of SLA printed structures using 3D printable nitrile-containing photopolymer resins](/sites/default/files/styles/scale_exact_400x400_/public/2024-04/SLA%20printed%20structures%20using%203D%20printable%20nitrile-containing%20photopolymer%20resins.jpg?itok=cVxxoNNY)
![Picture of interlocked electrode structure with metal plated surfaces](/sites/default/files/styles/scale_exact_400x400_/public/2024-03/Interlocked%20electrode%20structure%20with%20metal%20plated%20surfaces.jpg?itok=1A_mLJdP)
LLNL researchers have developed a fabrication process for creating 3D random interdigitated architectures of anodes and cathodes, eliminating the need for a membrane to separate them. This approach is similar to the repeating interdigitated multi-electrode architectures that also were developed at LLNL.
![Printed TPMS membrane structures using nanoporous photoresist](/sites/default/files/styles/scale_exact_400x400_/public/2023-12/Printed%20TPMS%20membrane%20structures.png?itok=siH1EwC9)
LLNL researchers have developed novel advanced manufactured biomimetic 3D-TPMS (triply periodic minimal surface) membrane architectures such as a 3D gyroid membrane. The membrane is printed using LLNL's nano-porous photoresist technology. LLNL’s 3D-TPMS membranes consist of two independent but interpenetrating macropore flow channel systems that are separated by a thin nano-porous wall. 3D-…
![Custom PCB design of a PCSS Laser Diode Driver](/sites/default/files/styles/scale_exact_400x400_/public/2023-11/PCSS%20Laser%20Diode%20Driver.png?itok=WQ2FNHQF)
LLNL researchers have invented an ultrafast PCSS to drive a high-power laser diode with arbitrary pulse widths. These devices operate by supplying a high voltage (>10 kV) to one side of the switch. A short pulse of light illuminates the semiconductor, instantly turning it from highly resistive to highly conductive.
![JFET Device Structure](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/JFET%20device%20structure.png?itok=NRzXbnhk)
LLNL’s novel approach is to use diamond substrates with the desired donor (nitrogen) and acceptor (boron) impurities. In order to optically activate these deep impurities, the invention requires at least one externally or internally integrated light source. The initial exposure to light can set up the desired conduction current, after which the light source could be turned off. Even with…
![Tunneling Diode between two DSRDs](/sites/default/files/styles/scale_exact_400x400_/public/2023-10/TunnelingDiode.png?itok=DfeB26vp)
Instead of producing individual DSRDs and bonding them, Tunnel DSRD's entire stack structure is grown epitaxially on a n- or p-type silicon wafer, resulting in a novel, “monolithic” stacked DSRD. A tunnel diode is essentially a diode with very highly doped p and n regions such that the reverse breakdown voltage is 200 meV or lower.
![Electrodeposition of Zn onto 3D printed copper nanowire (CuNW)](/sites/default/files/styles/scale_exact_400x400_/public/2023-07/ElectrodepositionofZnon3dprintedCuNW.jpg?itok=2G2D1kt9)
Improving the active material of the Zn anode is critical to improving the practicality of Zn-MnO2 battery technology. LLNL researchers have developed a new category of 3D structured Zn anode using a direct-ink writing (DIW) printing process to create innovative hierarchical architectures. The DIW ink, which is a gel-based mixture composed of zinc metal powder and organic binders, is extruded…
![thermoelectric cooler (TEC) embedded substrate for cooling of high power devices](/sites/default/files/styles/scale_exact_400x400_/public/2023-06/TEC%20embedded%20substrate.png?itok=vEz7ndQ8)
For cooling a high power device, the novel approach is to use a thermoelectric cooler (TEC)-based embedded substrate with proper selection of the TEC material as an active cooler. The packaging configuration of TEC allows cooling the entire die without the use of a fluid. The process is compatible with the thin film TEC material. Standard semiconductor processes can be used to manufacture…
![New class of lattice-based substrates](/sites/default/files/styles/scale_exact_400x400_/public/2023-05/lattice-based%20substrate.png?itok=vFuqTT03)
To get the best of both worlds – the sensitivity of LC-MS with the speed of PS-MS – and a functional substrate that can maintain sample integrity, LLNL researchers looked to 3D printing. They have patented a novel approach to create lattice spray substrates for direct ionization mass spectroscopy using 3D-printing processes.
![SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.](/sites/default/files/styles/scale_exact_400x400_/public/2023-05/SEM%20image%20prototype%20neural%20implant%20shuttle.png?itok=fpnfB5Yr)
For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process. The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer. The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…
![Unique LLNL capabilities enable GaN superjunctions](/sites/default/files/styles/scale_exact_400x400_/public/2023-05/GaNSuperjunctions.png?itok=UtrYddDz)
The approach is to use Charge Balance Layers (CBLs) to create a superjunction device in wide bandgap materials. These CBLs enable the device to effectively spread the electric field over 2- or 3-dimensions within a semiconductor voltage sustaining layer instead of 1-dimension, thereby increasing the maximum voltage a device is capable of withstanding. The challenge of using CBLs is the…
![3D Printing of High Viscosity Reinforced Silicone Elastomers](/sites/default/files/styles/scale_exact_400x400_/public/2023-05/3dPrintableSiliconeInks.png?itok=C6lgLCTy)
LLNL researchers, through careful control over the chemistry, network formation, and crosslink density of the ink formulations as well as introduction of selected additives, have been successful in preparing 3D printable silicone inks with tunable material properties. For DIW (direct in writing) applications, LLNL has a growing IP portfolio around 3D printable silicone feedstocks for diverse…
![3D Printing of Fiber Reinforced Composite Thermoset Structures](/sites/default/files/styles/scale_exact_400x400_/public/2023-04/3D%20Printing%20of%20FRC.png?itok=WZfsZPZy)
LLNL’s method of 3D printing fiber-reinforced composites has two enabling features:
![AgAg2S reference electrode](/sites/default/files/styles/scale_exact_400x400_/public/2022-06/AgAg2S%20reference%20electrode.jpg?itok=kL2OzfHy)
LLNL has developed a reference electrode that is a great improvement on the widely used silver or platinum wire QRE commonly used in electrochemistry in ionic liquids. This new reference electrode, based on a silver-sulfide coated silver wire, exhibits greatly improved stability over a QRE. The stability of our RE approaches that of the Ag/Ag+ RE, but unlike the Ag/Ag+ RE, the RE reported here…