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Fabrication of height modulated and tapered features in fused silica

This LLNL invention allows for the fabrication of complex waveplate features and topologies from fused silica, a highly desirable and durable waveplate material.  It also is a unique technique for density multiplication and high-fidelity bidirectional deposition, which can create optical components that are generally for entirely new classes of optical materials.

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Standing in LLNL’s Center for Micro Nano Technology, Nathan Ray holds a marvel of optical engineering, a 5-centimeter metasurface optic

This LLNL invention concerns a method for patterning the index of refraction by fabricating a spatially invariant metasurface, and then apply spatially varied mechanical loading to compress the metasurface features vertically and spread them radially. In doing so, the index of refraction can be re-written on the metasurface, thus enabling index patterning. This process allows rapid 'rewriting…

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Stock image of brain and electronic interface

LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more…

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SEM image of etched metasurface with angled features

This novel invention specifically enables the fabrication of arbitrarily tailored birefringence characteristics in nano-structured meta-surfaces on non-birefringent substrates (e.g. fused silica). The birefringent nano-structured meta-surface is produced by angled directional reactive ion beam etching through a nano-particle mask. This method enables the simultaneous tailoring of refractive…

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Schematic of one methodology for achieving a thicker substrate engraved meta-surface (SEMS) layer

This invention (US Patent No. 11,294,103) is an extension of another LLNL invention, US Patent No. 10,612,145, which utilizes a thin sacrificial metal mask layer deposited on a dielectric substrate (e.g. fused silica) and subsequently nanostructured through a laser generated selective thermal de-wetting process.

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Picture of SLA printed structures using 3D printable nitrile-containing photopolymer resins

LLNL’s invention is a photopolymerizable polymer resin that consists of one or more nitrile-functional based polymers. The resin is formulated for SLA based 3D printing allowing for the production of nitrile-containing polymer components that can then be thermally processed into a conductive, highly graphitic materials. The novelty of the invention lies in (1) the photo-curable nitrile-…

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Picture of interlocked electrode structure with metal plated surfaces

LLNL researchers have developed a fabrication process for creating 3D random interdigitated architectures of anodes and cathodes, eliminating the need for a membrane to separate them.  This approach is similar to the repeating interdigitated multi-electrode architectures that also were developed at LLNL. 

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Scanning electron micrograph of scalable, grating-like nanoscale metal mask (line period ~35 nm)

This invention consists of a method of forming nanoscale metal lines to produce a grating-like mask with wide area coverage over the surface of a durable optical material such as fused silica. Subsequent etching processes transfer the metal mask to the underlying substrate forming a birefringent metasurface. This method enables the production of ultrathin waveplates for high power laser…

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Scanning electron micrograph of bulk metamaterial structures fabricated at LLNL

Heat sensitive materials such as piezoelectric and MEMS devices and assemblies, magnetic sensors, nonlinear optical crystals, laser glass or solid-state laser materials, etc. cannot be exposed to excess temperatures which in the context of this invention, means materials that cannot be exposed to temperatures greater than 50°C (122°F). LLNL’s invention describes a low-temperature method of…

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Printed TPMS membrane structures using nanoporous photoresist

LLNL researchers have developed novel advanced manufactured biomimetic 3D-TPMS (triply periodic minimal surface) membrane architectures such as a 3D gyroid membrane. The membrane is printed using LLNL's nano-porous photoresist technology.  LLNL’s 3D-TPMS membranes consist of two independent but interpenetrating macropore flow channel systems that are separated by a thin nano-porous wall…

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Electrodeposition of Zn onto 3D printed copper nanowire (CuNW)

Improving the active material of the Zn anode is critical to improving the practicality of Zn-MnO2 battery technology. LLNL researchers have developed a new category of 3D structured Zn anode using a direct-ink writing (DIW) printing process to create innovative hierarchical architectures.  The DIW ink, which is a gel-based mixture composed of zinc metal powder and organic binders, is…

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New class of lattice-based substrates

To get the best of both worlds – the sensitivity of LC-MS with the speed of PS-MS – and a functional substrate that can maintain sample integrity, LLNL researchers looked to 3D printing.  They have patented a novel approach to create lattice spray substrates for direct ionization mass spectroscopy using 3D-printing processes.

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3D Printing of High Viscosity Reinforced Silicone Elastomers

LLNL researchers, through careful control over the chemistry, network formation, and crosslink density of the ink formulations as well as introduction of selected additives, have been successful in preparing 3D printable silicone inks with tunable material properties.  For DIW (direct in writing) applications, LLNL has a growing IP portfolio around 3D printable silicone feedstocks for…

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Linearly polarized light entering a half-wave plate can be resolved into two waves, parallel and perpendicular to the optic axis of the waveplate ("Waveplate" by Bob Mellish is licensed under CC BY-SA 3.0).

This novel method of producing waveplates from isotropic optical materials (e.g. fused silica) consists of forming a void-dash metasurface using the following process steps:

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Schematic of high density detachable electrical interfaces with a single layer

Many of the disadvantages of current interface devices can be overcome with LLNL’s novel interface design, which relies on area array distribution where independent interface connector subassemblies are positioned in a planar grid.  Not only is the interface device expandable area-wise (without increasing contact force), but it could also be expanded height-wise, with multiple layers of…

IPO logo over a face profile with interconnected lines

LLNL’s method of 3D printing fiber-reinforced composites has two enabling features:

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Flexible optoelectronic chip with integrated transmitter and receiver subassemblies

Commercial fiber optic cables are the current standard for carrying optical signals in industries like communications or medical devices. However, the fibers are made of glass, which do not have favorable characteristics for applications that require flexibility and re-routing, e.g. typically brittle, limited selection of materials, dimension constraints.

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iChip, brain on a chip

LLNL has developed a brain-on-a-chip system with a removable cell-seeding funnel to simultaneously localize neurons from various brain regions in an anatomically relevant manner and over specific electrode regions of a MEA. LLNL’s novel, removable cell seeding funnel uses a combination of 3D printing and microfabrication that allows neurons from select brain regions to easily be seeded into…