Skip to main content
Image
Electrochemical CO2 conversion to valuable fuels and chemicals

LLNL’s researchers use physical vapor deposition (sputter deposition or electron beam deposition) to coat an inert gasket material (i.e. PTFE) with a conductive metal (i.e. copper). The gas diffusion electrode overlaps onto the copper coated gasket to allow for electrical conductivity between the catalyst surface and the flow field/current collector of a CO2 electrolyzer. The coated gasket…

Image
SEM image of nanoporous Cu catalyst material

Using their computational design optimization, LLNL researchers have developed copper-based dilute alloy catalysts (contains <10 at.% of the minority metal alloy component) and demonstrated these novel catalysts have improved energy efficiency and selectivity of the methane conversion reaction.  By alloying copper with a small amount of the electropositive minority metal element, the…

Image
Custom PCB design of a PCSS Laser Diode Driver

LLNL researchers have invented an ultrafast PCSS to drive a high-power laser diode with arbitrary pulse widths.  These devices operate by supplying a high voltage (>10 kV) to one side of the switch.  A short pulse of light illuminates the semiconductor, instantly turning it from highly resistive to highly conductive.

Image
JFET Device Structure

LLNL’s novel approach is to use diamond substrates with the desired donor (nitrogen) and acceptor (boron) impurities.   In order to optically activate these deep impurities, the invention requires at least one externally or internally integrated light source.  The initial exposure to light can set up the desired conduction current, after which the light source could be turned off.  Even with…

Image
Tunneling Diode between two DSRDs

Instead of producing individual DSRDs and bonding them, Tunnel DSRD's entire stack structure is grown epitaxially on a n- or p-type silicon wafer, resulting in a novel, “monolithic” stacked DSRD.  A tunnel diode is essentially a diode with very highly doped p and n regions such that the reverse breakdown voltage is 200 meV or lower. 

Image
Graphite

LLNL’s innovation offers an alternate synthetic route to graphite at lower cost using a molten salt mixture of CaCl2-CaCO3-CaO.  The synthetic production of graphite and other high-value carbon materials is accomplished in molten salt media via electrochemical reduction and transformation of the carbon from the carbonate ion. The broad electrochemical window of molten salts enables the…

Image
thermoelectric cooler (TEC) embedded substrate for cooling of high power devices

For cooling a high power device, the novel approach is to use a thermoelectric cooler (TEC)-based embedded substrate with proper selection of the TEC material as an active cooler.  The packaging configuration of TEC allows cooling the entire die without the use of a fluid.  The process is compatible with the thin film TEC material.  Standard semiconductor processes can be used to manufacture…

Image
SEM image of a prototype for a neural implant shuttle etched into a non-SOI wafer. The 7:1 (Si:Photoresist) etch selectivity used here allowed for a maximum structure height of 32 μm, with up to 75 steps of 0.4 μm height each. Scale bar 100 μm.

For this method, a Silicon on Insulator (SOI) wafer is used to tailor etch rates and thickness in initial steps of the process.  The simple three step process approach is comprised of grayscale lithography, deep reactive-ion etch (DRIE) and liftoff of the SOI wafer.  The liftoff process is used to dissolve the insulating layer, thus separating sections of the wafer as individual silicon…

Image
Unique LLNL capabilities enable GaN superjunctions

The approach is to use Charge Balance Layers (CBLs) to create a superjunction device in wide bandgap materials.  These CBLs enable the device to effectively spread the electric field over 2- or 3-dimensions within a semiconductor voltage sustaining layer instead of 1-dimension, thereby increasing the maximum voltage a device is capable of withstanding.  The challenge of using CBLs is the…

Image
Projection Microstereolithographic Additively Manufactured Anion Exchange Membrane

The novel LLNL approach is to use projection microstereolithography (LAPµSL), starting with a photocurable methacrylate resin formulation consisting of a combination of a photoinitiator, photoabsorber, inhibitor, solvents, and other additives.  Prior to use, the resin is pretreated to control viscosity for easier handling.  The resin is fed to a LAPµSL printer which employs a near UV light…

Image
SEM image showing internal porosity of DIW printed parts

The inventors have developed a 3% Yttria partially-stabilized Zirconia (3YZ) ceramic ink that produces parts with both nano and microporosity and is compatible with two AM techniques: DIW and projection microstereolithography (PμSL). The 3YZ nano-porous ceramic printed parts had engineered macro cavities measuring several millimeters in length, wall thicknesses ranging from 200 to 540 μm, and…

Image
Microcapsules offer high surface area and a superior delivery system.

This invention describes a multiple nozzle microfluidic unit that allows simultaneous generation streams of multiple layered coaxial liquid jets. Liquids are pumped into the device at a combined flow rate from 100 mL/hr to 10 L/hr. Droplets are created with diameters in the range of 1 µm to 5 mm and can be created with 1-2 shell layers encapsulating fluid. Droplets created from the system can…